Peer-reviewed veterinary case report
How to safely transfer flexible copper mesh films for electronics?
By Yang Y et al.·2026·School of Electronics and Information Technology, China·View original on Europe PMC →
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Original publication title: Clean, Ice-Assisted Transfer of Flexible Transparent Copper Mesh Films for Electrothermal Heating and Terahertz Shielding.
Plain-English summary
This research focuses on a new method for transferring flexible transparent conductive films, which are important for modern electronics. The study introduces an ice-assisted technique that helps move copper mesh films without damaging them or leaving behind unwanted residues. The transferred copper mesh is highly transparent and conducts electricity well, making it suitable for various surfaces, including glass and flexible materials. Additionally, the films can be used to create flexible heaters that heat up quickly and maintain a stable temperature, as well as provide effective shielding against electromagnetic interference. Overall, this new transfer method successfully preserves the quality and functionality of the copper mesh films.
Abstract
Flexible transparent conductive films (TCFs) are essential components for emerging flexible electronics. Among various candidates, metal mesh films offer an effective structural route to balance transparency and conductivity. However, metal mesh films often suffer from structural damage, interfacial residues, and poor compatibility with different flexible substrates during a traditional transfer process. Here, we reported an ice-assisted transfer strategy using temporary ice layers as transfer media, achieving efficient transfer of copper (Cu) mesh with clean, low damage, and substrate compatibility. The transferred Cu mesh film achieves a transmittance of 82.0% at 550 nm, and a sheet resistance of 144 mΩ/□ on TPU substrates, showing a remarkable figure of merit (FoM) of 12 524. The Cu mesh film maintained similar performance on various substrates, including hard glass, flexible polymers, skin, etc. Based on the transferred Cu mesh film, flexible transparent heaters are fabricated. The heater exhibited a high saturated temperature at a low heating voltage (>200 °C at 1.0 V), high stability (>300 min), and fast heating rate (>10 °C/s). The transparent Cu mesh film also demonstrated an average electromagnetic interference shielding effectiveness (EMI SE) of 19.0 dB in the 0.2-1.6 THz. By multilayer stacking, the resulting film showed an average EMI SE of 46.4 dB. These results indicate that the ice-assisted transfer strategy ensures the integrity of the metal mesh while retaining its superior optoelectronic characteristics and functional adaptability, providing an efficient and clean method for preparing TCFs.
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Search related cases →Original publication on Europe PMC: https://europepmc.org/article/MED/42003730