Non-loss engraved circuit patterning method of semi-liquid metal for precision recyclable multi-substrate circuits.

Abstract

Room-temperature liquid metal alloys have emerged as promising materials for flexible electronics due to their unique fluidity, conductivity, and biocompatibility. However, traditional patterning techniques for liquid metal circuits, including additive and subtractive manufacturing, face challenges such as high costs, complex processes, and environmental issues, limiting their large-scale application. This study presents a non-loss method for fabricating high-precision semi-liquid metal circuits by leveraging ethanol to modulate interfacial adhesion between liquid metal and substrates. By precisely controlling adhesion through a custom-designed displacement apparatus, the approach enables seamless patterning from 5 μm to centimeter scales across diverse substrates with features like stretchability (1000% strain), reusability, and recyclability. The technique overcomes limitations of conventional methods, offering advantages in cost-effectiveness, operational simplicity, and substrate compatibility. Demonstrations include multifunctional flexible circuits for wearable electronics, aerospace, and smart home applications, highlighting its potential to advance sustainable, scalable liquid metal electronics manufacturing.